Prof. Yongjun Xu, Chongqing University of Posts and Telecommunications

徐勇军教授，重庆邮电大学

徐勇军(1986-)，博士/博士后，重庆邮电大学通信与信息工程学院文峰教授，博士生、硕士生导师，重庆市巴渝学者(青年)，重庆邮电大学文峰青年百人，IEEE Senior Member, 电子与信息学报青年编委，中国电子学会高级会员，中国通信学会高级会员，IMT-2030 6G工作组-智能超表面技术白皮书撰写人之一，吉林省优秀博士论文获得者，美国犹他州立大学访问学者，移动通信技术重庆市重点实验室秘书，RISTA智能超表面技术联盟单位联络人，中国通信学会人工智能技术与应用委员会秘书，大陆汽车电子(重庆)研发中心C-V2X算法设计带头人，全国高校黄大年式教师团队核心成员，中国通信学会重庆邮电大学学生会员服务中心指导老师，重庆市石油与天然气学会理事，中国通信学会专业委员会年度先进工作者，电子与信息学报年度优秀审稿人，电讯技术年度优秀审稿人，重庆邮电大学学报自然科学版优秀审稿人。主要从事B5G/6G通信、反向散射通信、UAV通信、智能反射面、异构无线网络、无线携能通信、无线资源管理等方面的研究。近五年来，主持国家自然科学基金面上/青年、国防装备发展预研项目、重庆市自然科学基金重点等科研项目20余项，已在《IEEE Communications Surveys and Tutorials》, 《IEEE TCOM》等国际期刊及主流学术会议上发表学术论文100余篇，累计影响因子200+，SCI论文80余篇，ESI热点1篇，ESI高被引2篇，申请国家发明专利40余项，授权26项，成果转化20项。曾获得重庆市自然科学二等奖(第一完成人)、中国自动化学会自然科学二等奖(第二完成人)、川渝产学研创新成果二等奖(第一完成人)、吉林省优秀博士学位论文奖(第一完成人)、重庆市期刊优秀论文一等奖(第一完成人)等奖项10余项。

Yongjun Xu (Senior Member, IEEE) received the Ph.D. degree (Hons.) in communication and information system from Jilin University, Changchun, China, in 2015. He is an Associate Professor in Chongqing University of Posts and Telecommunications, Chongqing, China. He is also a Bayu Youth Scholar of Chongqing. From December 2018 to December 2019, He was a Visiting Scholar in the Utah State University, Logan, UT, USA. His recent interests include C-V2X, intelligent mobile networks, heterogeneous networks, resource allocation, intelligent reflecting surface, energy harvesting, backscatter communications, etc. He has published more than 100 IEEE Journal/Conference papers and received the Outstanding Doctoral Thesis of Jilin Province in 2016. He serves as an editor for Physical Communication, EURASIP Journal on Wireless Communications and Networking, Digital Communications and Networks, Chongqing YouDian Daxue XueBao, and also a reviewer for IEEE Transactions on Wireless Communications, IEEE Transactions on Industrial Electronics, IEEE Transactions on Intelligent Vehicles, IEEE Transactions on Vehicular Technology, IEEE Communications Letters, and China Communications, etc. He serves on the Chair of ICCT 2023, ICCC 2020, WCSP 2021, and also a TPC member of many IEEE international conferences, such as Globecom, ICC, ICCT, WCNC, ICCC, and CITS.